Yamamura Photonics Co., Ltd. (Headquarters: Kanagawa Prefecture, President and CEO: Koichi Ikoma) will exhibit a booth at the 27th IC & SENSOR PACKAGING EXPO- Asia’s Leading Exhibition for IC Final Manufacturing, part of the 40th NEPCON Japan – R&D and Manufacturing, held jointly with its parent company, Nippon Yamamura Glass Co., Ltd. (Headquarters: Hyogo Prefecture, President and CEO: Noboru Yamamura), from Wednesday, January 21 to Friday, January 23, 2026.

・Exhibition Title：40th NEPCON JAPAN 2026 – R&D and Manufacturing

・Structure Exhibition：IC & SENSOR PACKAGING EXPO (Commonly known as ISP)

・Dates：2Jan. 21(Wed) – 23(Fri), 2026 10:00～17:00

・Venue：Tokyo Big Sight, Japan

・Organizer：RX Japan GK

・Our Booth Number：E32-59