PRODUCTS

PRODUCTS UNDER DEVELOPMENT

Products Under Development

B‑stage Adhesives

Products Under Development

B‑stage Adhesives

OUTLINE

Yamamura Photonics is developing B-stage adhesive products. B-stage adhesive products are made by applying the resin material named "hybrid material" developed by the new glass company of Nihon Yamamura Glass Co., Ltd. to the components in any shape and making it semi-cured. It is possible to form an adhesive layer on various components, such as glass substrates and dome lenses, by dispensers or screen printing.
"Hybrid material" has excellent UV resistance and can join almost any material such as metal, ceramics, and glass. Its curing temperature is 180 to 250 ° C, which is lower than the joining temperature for sealing glasses and brazing materials. By taking advantage of these features, B-stage adhesive products are applied to various purposes, such as UV-LED packages and MEMS packages with low heat resistance of devices.

Specifications under development

Method of Application: Dispensing, Screen Printing, etc.
Applicable shape: Plate, lens, etc.
Curing Condition: Recommended 250℃ × 2hr Low temperature 180℃ × 6hr
Hermeticity: Around 1×10-8Pa・sec/m3
Storage condition: Freezing for about 2 to 3 months
Various characteristics:coming soon
Hybrid material
Nihon Yamamura Glass Co., Ltd. New Glass Company

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